| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper clad laminate for high frequency substrates in which the transmission loss of a copper foil composing a conductive layer of a print circuit board during high frequency transmission is reduced to improve transmission characteristics, and the adhesiveness between a copper foil layer and a resin layer is bettered, and a surface treated copper foil.SOLUTION: The copper clad laminate for high frequency substrates is manufactured by a method for heat-compression molding a copper foil made by forming a metallic treatment layer on the surface of the copper foil and then coating it with a silane coupling agent, and a resin composition containing polyphenylene ether. In the copper clad laminate for high frequency substrates, the adhesion strength between the resin composition containing the polyphenylene ether and the copper foil is not less than 0.6 kN/m. |
