| 摘要 |
<p>PURPOSE:With respect to a semiconductor IC, such as a flat package, with terminals which cannot be inserted, to obtain an electrically conductive sponge designed to prevent terminals of the IC from being bent when the IC is stored or transferred. CONSTITUTION:Recesses 2 for housing a flat package are formed in the surface of an electrically conductive sponge 1, thereby preventing the collision of the flat packages with one another during the transfer thereof. With these recesses, even in the case of flat packages, it is possible to store and carry the packages without bending the terminals thereof.</p> |
