发明名称 ワイヤボンディング装置
摘要 PROBLEM TO BE SOLVED: To enable easy detection and calibration of a load on a bonding object without a complicated structure and a mechanism.SOLUTION: A wire bonding device for wire bonding bonding objects (15, 16) on a heat block 12 includes an arbitrarily detachable heat block 12. With the disposition of a detachable load measurement unit 20 having a distortion gouge unit 21 at the detachment position of the heat block 12, each load on the bonding objects (15, 16) is calibrated based on the output of the load measurement unit 20. The load measurement unit 20 is formed to have a substantially identical shape and a size to the heat block 12.
申请公布号 JP5972153(B2) 申请公布日期 2016.08.17
申请号 JP20120254909 申请日期 2012.11.21
申请人 新日本無線株式会社 发明人 河野 正俊
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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