| 摘要 |
<p>PURPOSE:To enable a rapid vaccuming without dampling objects such as wafers by a method wherein when vaccuming is carried out removing dirty grains inside, flow velocity of gas to be exhausted is reduced during it flows in the vicinity of the objects. CONSTITUTION:When wafers 21 are carried in, a lid 4 is brought into contact with a flange 2 through a seal 3, and sealed sritight with clamps 5. Then a vacuum source is connected to a suction port 7 for vaccuming. In this instance, as a deflector 30 is provided between the suction port 7 and the wafers 21, the gas inside a carry box BX flows first, as indicated by arrows, mainly through gaps between four sides of the deflector 30 and four side walls 10 and 11 of the carrier box BX, and then is exhausted out of the suction port 7. Accordingly, the velocity of an airstream drops down when it flows around the wafers 21. Thus, though a large amount of air exhausted for a short time, there is no possibility that the wafers 21 vibrate or they are damaged because of the vibration.</p> |
