| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method which allows for efficient cutting of a multilayer substrate at a low cost.SOLUTION: The cutting method of a multilayer substrate 10 in which a resin layer 12 is formed on a substrate body 11 formed of ceramic or metal includes a first cutting step (a) for cutting the resin layer 12, and a second cutting step (b) for cutting the substrate body 11 with laser light 32. In the first cutting step (a), the resin layer 12 is cut by using a dicer 31 or other laser light different from the laser light 32 of the second cutting step (b). The laser light 32 in the second cutting step (b) is the laser light generated by CW oscillation of a fiber laser oscillator. |
