| 摘要 |
The invention discloses a compound type LED circuit board and a manufacturing method. The compound type LED circuit board comprises aluminum substrates. Inset holes are punched in the aluminum substrates, then insulation substrates flush with the surfaces of the aluminum substrates are embedded in the inset holes, and therefore a compound substrate is formed. Then, semi-dry glue and conductive copper foil for electric conduction are sequentially laid on the surface of the compound substrate from inside to outside, constant pressure and constant temperature are applied, the semi-dry glue is cured to form an insulation layer, and therefore a compound PCB is formed. Finally, drive power elements are arranged at the positions, corresponding to the insulation substrates, of the compound PCB, and therefore a drive board is formed. LED lamp beads are arranged at the positions, corresponding to the aluminum substrates, of the compound PCB, and therefore a lamp board is formed, and the lamp board and the drive board can be connected through the conductive copper foil. Connection between the lamp board and the LED drive board can be remarkably simplified, and is good in consistency and high in reliability, and therefore manpower can be saved, and manufacturing cost can be reduced. |
