| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder material that can form a solder part having excellent thermal fatigue characteristics.SOLUTION: This invention relates to a solder material. When content (mass%) of Ag, Bi, Cu, and In in the solder material are set as [Ag], [Bi], [Cu], and [In], Ag of 0.3≤[Ag]<4.0 (excluding the case of Ag being 0.5 mass%, 1.0 mass%), Bi of 0≤[Bi]≤1.0, and Cu of 0.2≤[Cu]≤1.2 are contained. In the range of 0.2≤[Cu]<0.5, In in the range of 6.0≤[In]≤6.8 is contained. In the range of 0.5≤[Cu]≤1.0, In in the range of 5.2+(6-(1.55×[Cu]+4.428)≤[In]≤6.8 is contained. In the range of 1.0<[Cu]≤1.2, In in the range of 5.2≤[In]≤6.8 is contained. The balance is only Sn of 87 mass% or more. |
