发明名称 COMBINED WAFER PRODUCTION METHOD WITH LASER TREATMENT AND TEMPERATURE-INDUCED STRESSES
摘要 The present invention relates to a method for the production of layers of solid material. The method according to the invention comprises at the very least the steps of providing a solid body (2) for the separation of at least one layer of solid material (4), generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer (10) disposed on the solid body (2) in order to generate, in particular mechanically, stresses in the solid body (2), due to the stresses a crack propagating in the solid body (2) along the detachment plane (8), which crack separates the layer of solid material (4) from the solid body (2).
申请公布号 EP3055098(A1) 申请公布日期 2016.08.17
申请号 EP20140781231 申请日期 2014.10.08
申请人 SILTECTRA GMBH 发明人 DRESCHER, WOLFRAM;RICHTER, JAN;BEYER, CHRISTIAN
分类号 B23K26/00;B23K26/40;B28D5/00;H01L21/268;H01L31/18 主分类号 B23K26/00
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