ROOM TEMPERATURE BONDING APPARATUS

摘要

This room temperature bonding apparatus is provided with: a plurality of first beam sources, which respectively output a plurality of first activation beams to be radiated to the first activation surface of a first substrate; a plurality of second beam sources, which respectively output a plurality of second activation beams to be radiated to the second activation surface of a second substrate; and a pressure contact mechanism, which bonds the first substrate and the second substrate to each other by bringing the first activation surface and the second activation surface into contact with each other after the first activation surface and the second activation surface are irradiated with the beams. Compared with other room temperature bonding apparatuses that use one beam source for each of the first activation surface and the second activation surface, the room temperature bonding apparatus is capable of having the first activation surface and the second activation surface more uniformly irradiated with the beams, and is capable of more suitably bonding the first substrate and the second substrate to each other.