| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which improve alignment accuracy at low cost and achieves downsizing and high-density mounting of a semiconductor chip.SOLUTION: A semiconductor device manufacturing method comprises: forming a first recess 5 for mounting a semiconductor chip 9, in a conductive pattern 4 of an insulating substrate 1 with the conductive pattern; passing an alignment external terminal 17 fastened to the conductive pattern 4 through a through hole 12 of a printed circuit board 11 with a post pin; and aligning tips of the post pins 16 on a gate pad 9b and an emitter electrode pad 9a of the semiconductor chip 9. Accordingly, alignment accuracy of the post pin 16 and the pad 9b can be tremendously improved at low cost. |
