| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can improve electrical insulation properties.SOLUTION: A semiconductor device 100 comprises: a lead frame 2; a semiconductor element 1; an insulator 9; and pins 6. The lead frame 2 has one surface 2a and the other surface 2b, which are opposite to each other. The semiconductor element 1 is mounted on the one surface 2a of the lead frame 2. The insulator 9 covers the one surface 2a of the lead frame 2 and the semiconductor element 1, and includes holes 14 each of which reaches at least one component between the semiconductor element 1 and the lead frame 2. Each of the pins 6 is arranged in each hole of the insulator 9 and electrically insulated from the semiconductor element 1 and the lead frame 2 and includes a conductive part 8a. |
