发明名称 半導体発光素子および発光装置
摘要 A semiconductor light emitting element (1) includes; an n-type semiconductor layer (120), a light emitting layer (130), a p-type semiconductor layer (140), a p-side power supply portion (150), and an n-side power supply portion (160). A p-side power supply electrode (152) in the p-side power supply portion (150) and an n-side power supply electrode (162) in the n-side power supply portion (160) are provided at a rear side of the p-type semiconductor layer (140), a power supply insulating layer (170) set to have a first thickness is formed between the p-type semiconductor layer (140) and the p-side power supply electrode (152) or the n-side power supply electrode (162), and a portion where these electrodes are not provided is set to have a third thickness by forming the protective insulating layer (180) set to have a second thickness in addition to the power supply insulating layer (170).
申请公布号 JP5971090(B2) 申请公布日期 2016.08.17
申请号 JP20120250681 申请日期 2012.11.14
申请人 豊田合成株式会社 发明人 篠原 裕直
分类号 H01L33/44;H01L33/38 主分类号 H01L33/44
代理机构 代理人
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