| 摘要 |
An example package comprising: an RF circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the RF circuit; and an encapsulant material coupled to cover the RF circuit and cavity structure on at least one side of the RF circuit. An example method of package manufacture, comprising: identifying an RF circuit; forming a cavity structure upon the RF circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the RF circuit; and covering the RF circuit and cavity structure with an encapsulant material on at least one side of the RF circuit. |
