发明名称 配線基板、実装基板、電子機器、製造システム、および位置調整方法
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of correcting displacement of an electronic component at low costs.SOLUTION: The wiring board has: a first connection section on which a first electrode of an electronic component is arranged; a second connection section on which a second electrode of the electronic component is arranged; a first reference section positioned so that it is not overlaid on the first electronic component; and a protection film. A region, in which the protection film is not overlaid on the first connection section, the second connection section and the first reference section, and is not positioned between the first connection section and the second connection section, between the first reference section and the first connection section, and between the first reference section and the second connection section, and that is between the first connection section and the second connection section is designated as a first region. A region that is different from the first region and is not overlaid on any of the first connection section and the second connection section is designated as a second region. When it is assumed that virtual straight lines extend in the first region and the second region and are not overlaid on any of the first connection section and the second connection section, the first reference section is positioned to be overlaid on the virtual straight line of the second region.
申请公布号 JP5970702(B2) 申请公布日期 2016.08.17
申请号 JP20120110740 申请日期 2012.05.14
申请人 セイコーエプソン株式会社 发明人 多次見 茂久
分类号 H05K1/02;H05K3/34 主分类号 H05K1/02
代理机构 代理人
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