发明名称 基板重ね合わせ装置および基板重ね合わせ方法
摘要 PROBLEM TO BE SOLVED: To verify accuracy of overlapping.SOLUTION: An overlapping device includes: a first stage which holds one of a plurality of substrates; a second stage which is disposed facing the first stage, is relatively movable to the first stage, and holds the others of the plurality of substrates; and an observation part which observes alignment marks of the one and the other substrates when positioning the one substrate and the other substrates in a state that the first stage and the second stage hold the plurality of substrates, and observes the alignment marks in a state that the plurality of overlapped substrates are separated from the first stage and are held by the second stage.
申请公布号 JP5971367(B2) 申请公布日期 2016.08.17
申请号 JP20150042446 申请日期 2015.03.04
申请人 株式会社ニコン 发明人 吉橋 正博;堀越 崇広
分类号 H01L21/02;H01L21/60;H01L21/68 主分类号 H01L21/02
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