发明名称 半導体発光装置用封止剤、これを用いた半導体発光装置用封止材及び半導体発光装置
摘要 PROBLEM TO BE SOLVED: To provide a sealing agent for a semiconductor light-emitting device excellent in transparency, heat resistance, gas barrier properties and adhesiveness with a package which are required in applications for a semiconductor light-emitting device and to provide a sealing agent of a semiconductor light-emitting device using the same and a semiconductor light-emitting device.SOLUTION: There is provided a sealing agent for a semiconductor light-emitting device containing an isocyanurate compound and a disulfide compound containing a disulfide group and an alkoxysilyl group, represented by the following formula (1), wherein R, Rand Rare a substituent provided that at least one of Rto Rcontains an acryloyloxy group.
申请公布号 JP5972747(B2) 申请公布日期 2016.08.17
申请号 JP20120228271 申请日期 2012.10.15
申请人 富士フイルム株式会社 发明人 師岡 直之
分类号 C08F20/36;C08F2/44;H01L23/29;H01L23/31;H01L33/56 主分类号 C08F20/36
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