发明名称 スパッタリング装置
摘要 A sputtering apparatus includes a shutter arranged having a first surface on a side of a substrate holder and a second surface on the opposite side, a first shield having a third surface including a portion facing the second surface and a fourth surface on the opposite side, a second shield having a fifth surface including a portion facing end portions of the shutter and the first shield, and a gas supply unit supplying a gas into a space arranged outside the first shield to communicate with a first gap between the second surface of the shutter and the third surface of the first shield. The second shield includes a protruding portion on the fifth surface to form a second gap between the protruding portion and the end portion of the shutter.
申请公布号 JP5970607(B2) 申请公布日期 2016.08.17
申请号 JP20150510962 申请日期 2013.12.24
申请人 キヤノンアネルバ株式会社 发明人 石原 繁紀
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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