| 摘要 |
Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other. |
