| 摘要 |
PROBLEM TO BE SOLVED: To suppress solder from creeping up to one main surface from the other main surface where an external electrode is formed by way of a side surface when the external electrode is soldered to a mounting substrate, relating to a sealing member for an electronic component package in which an electrode of an electronic component element is formed on one main surface while the external electrode is formed on the other main surface.SOLUTION: A first sealing member 4 in which electrodes 31 and 32 of an electronic component element 2 are mounted on one main surface 42, and a second sealing member 7 which is jointed to the one main surface 42 of the first sealing member 4 for sealing the electrodes 31 and 32 of the electronic component element 2 in air-tight manner, constitute an electronic component package. Another main surface 43 of the first sealing member 4 is provided with external electrodes 53 and 54. Related to the other main surface 43, a region 432 between an outer peripheral edge 47 and the external electrodes 53 and 54 is covered with a wetting prevention film (resin pattern 61) made from the material whose solder wettability is lower than the external electrodes 53 and 54. |
