| 摘要 |
An object of the present invention is to provide a novel epoxy compound capable of forming a highly heat-resistant cured product. The epoxy compound of the present invention is a compound represented by the following formula (1):
wherein X 1 and X 2 are the same or different and represent an alkylene group, an oxygen atom, a sulfur atom, or no bond; R represents a bivalent group having one or more atoms; R 1 to R 8 are the same or different and represent a hydrogen atom, an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent; and Y 1 and Y 2 are the same or different and are a bivalent group represented by the following formula (a) :
or a bivalent group represented by the following formula (b) :
provided that least one of R 1 to R 12 in formula (1) is an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent. Besides, when both Y 1 and Y 2 in formula (1) are a bivalent group represented by formula (a), at least one of R 1 to R 10 is an epoxidized alkenyl group which may have a substituent. |
