| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition that can provide a cured product that is excellent in flame retardancy, and the electrical properties such as a dielectric constant and a dielectric loss tangent, and is excellent in the balance of moisture resistance, adhesion, heat resistance (soldering resistance), and a low coefficient of linear thermal expansion, and to provide the cured product.SOLUTION: A high molecular weight polyurethane resin in which the weight average molecular weight is in the range of 10,000-200,000, has a phenoxy group or a naphthoxy group in the side chain in the molecular structure, and has a urethane bond in the main chain. The epoxy resin composition includes: the high molecular weight polyurethane resin; an epoxy resin; and a curing agent. The cured product is obtained by curing the epoxy resin composition. |
