WIRING BOARD

摘要

A wiring board (10) includes an insulating substrate (1) having a side surface (1c) including a protrusion portion (1a) or a recess portion (1b) and a lower surface (1d) having a metal member (4) bonded thereto; a wiring conductor (2) embedded in the insulating substrate (1) and having an exposed portion (3) partially exposed above the protrusion portion (1a) or the recess portion (1b) from the side surface (1c) of the insulating substrate (1); and a metal member (4) bonded to the lower surface of the insulating substrate (1). It is possible to suppress occurrence of ion migration between the wiring conductor (2) and the metal member (4) by increasing a distance between the exposed portion (3) and the metal member (4) without increasing a thickness of the wiring board (10).