はんだ接合構造、パワーモジュール、ヒートシンク付パワーモジュール用基板、並びに、はんだ接合構造の製造方法、パワーモジュールの製造方法、ヒートシンク付パワーモジュール用基板の製造方法

摘要

PROBLEM TO BE SOLVED: To provide a solder joint structure capable of preventing a steel member change by a soldering material and reliably soldering a steel member and a joined material when soldering a copper member composed of copper and copper alloy.SOLUTION: A solder joint structure 40, which is fabricated by joining a copper member 13 composed of copper or copper alloy and a joined material 21 with a soldering material, includes a glass layer 41 formed on a surface of the copper member 13, an Ag layer 42 laminated on a glass layer 41, and a solder layer 43 laminated on the Ag layer 42. Crystalline oxide particles 44 are dispersed in the Ag layer 42.