发明名称 真空成膜装置
摘要 PROBLEM TO BE SOLVED: To provide a vacuum film deposition apparatus which forms a film on a substrate in a vacuum, allows miniaturization and simplification of the apparatus, enables continuous film formation of a plurality of thin films with mutually different film formation patterns and prevents unintended inclusion of film formation materials.SOLUTION: A vacuum film deposition apparatus 1 includes a carrying path 4 carrying an object 3 to be carried having a substrate 31 and a mask 34 covering the substrate 31 and a plurality of film formation sources 5 arranged in the carrying path 4. The carrying path 4 has a mask replacement mechanism 6 replacing the mask 33 with a mask 34 for replacement. Since the separation of the mask 33 and mounting of the mask 34 for replacement are carried out by the mask replacement mechanism 6, a single unit arranged in the carrying path 4, the apparatus can be miniaturized and simplified. Since the mask 33 can be replaced by the mask replacement mechanism 6, in addition, continuous film formation of a plurality of thin films with mutually different film formation patterns is feasible, and unintended inclusion of a film formation material adhered to the mask 33 in forming a film with another film formation material can be prevented.
申请公布号 JP5968770(B2) 申请公布日期 2016.08.10
申请号 JP20120263593 申请日期 2012.11.30
申请人 長州産業株式会社 发明人 西森 泰輔;宮川 展幸;福田 圭司;伊藤 満;美澄 隆行
分类号 C23C14/04 主分类号 C23C14/04
代理机构 代理人
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