发明名称 電子機器
摘要 An electronic device (100) is equipped with a housing (40), a circuit substrate (P), and a conductive sheet (101). The circuit substrate (P) is attached to the interior of the housing (40). Electronic components (50, 51, 52, 53) are mounted on the circuit substrate (P). The conductive sheet (101) has first flat sections (110, 111, 112), a second flat section (120), and connecting sections (130, 131). The conductive sheet (101) is shaped in a manner such that the connecting sections (130, 131) project farther toward the circuit substrate (P) than the first flat sections (110, 111, 112) and second flat section (120) do. The surfaces of the first flat sections (110, 111, 112) on the circuit-substrate (P) side are joined to the electronic components (50, 51, 52). In addition, the surface of the second flat section (120) on the opposite side from the circuit substrate (P) is joined to the inside surface of the housing (40).
申请公布号 JP5967206(B2) 申请公布日期 2016.08.10
申请号 JP20140536634 申请日期 2013.07.03
申请人 株式会社村田製作所 发明人 玉谷 康浩
分类号 H05K7/20;H01L23/36;H05K9/00 主分类号 H05K7/20
代理机构 代理人
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