Method for producing a structure with a cavity sealed hermetically under a controlled atmosphere

摘要

The method involves forming an electronic device (104) and a metallic material portion (110) on a substrate (106), where the material portion releases gas when a material is heated, and communicates with interior of a hermetically sealed cavity (102) of an encapsulation structure (100). The cavity is formed between the substrate and a cap (114). A total or a part of the portion of material is heated such that a part of gas is released from the material portion into the cavity.