发明名称 金属粉末およびその製造方法、導電性ペースト、ならびに積層セラミック電子部品の製造方法
摘要 PROBLEM TO BE SOLVED: To solve the problem that, for matching the shrinkage behavior upon co-firing between an internal electrode and a ceramic layer as much as possible, and as metal powder included in conductive paste forming the internal electrode, the one in which the grain thereof is covered with an oxide for thermal shrinkage suppression is frequently used, but the oxide may be peeled when temperature is made high in a firing process.SOLUTION: A particle 1 composing metal powder includes: a core material 2 consisting of a metal as a main component; and an external layer 3 consisting of an oxide which is arranged so as to cover at least a part of the outer surface of the core material 2. Further, the particle 1 includes an intermediate layer 4 formed along the boundary face between the core material 2 and the external layer 3. The intermediate layer 4 has a thickness of ≥0.2 nm and also includes the oxide of the metal used as a main component of the core material 2 formed by subjecting the core material 2 to heat treatment in an oxygen-containing atmosphere, wherein the oxide is different from the oxide composing the external layer 3. The intermediate layer 4 acts so as to suppress the peeling of the external layer 3 from the core material 2.
申请公布号 JP5966365(B2) 申请公布日期 2016.08.10
申请号 JP20110290196 申请日期 2011.12.29
申请人 株式会社村田製作所 发明人 鈴木 俊裕;中西 徹;緒方 直明
分类号 B22F1/02;B22F1/00;B82Y30/00;H01B1/00;H01B1/22;H01B5/00;H01B13/00;H01G4/12;H01G4/232;H01G4/30 主分类号 B22F1/02
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