发明名称 電気機器や機械機器・光学機器用の基板の化学機械研磨用の水性研磨組成物と方法
摘要 An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.
申请公布号 JP5965907(B2) 申请公布日期 2016.08.10
申请号 JP20130527717 申请日期 2011.09.06
申请人 ビーエーエスエフ ソシエタス・ヨーロピアBASF SE 发明人 リー,ユツホウ;チュー,チョア‐チュイ;ヴェンカタラマン,シアム スンダール;ウスマン イブラヒム,シェイク アンサル;ピンダー,ハーヴェイ ウエイン
分类号 C09K3/14;B24B37/00;H01L21/304 主分类号 C09K3/14
代理机构 代理人
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