发明名称 |
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR FABRICATING PRINTED WIRING BOARD |
摘要 |
Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less. |
申请公布号 |
EP3054751(A2) |
申请公布日期 |
2016.08.10 |
申请号 |
EP20160154596 |
申请日期 |
2016.02.08 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
KOHIKI, MICHIYA |
分类号 |
H05K3/02;H05K3/40;H05K3/42 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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