| 摘要 |
PROBLEM TO BE SOLVED: To provide a communication module that facilitates mounting of components substitute for existing IC components for non-contact communication processing to a mother board that mounts the existing IC components.SOLUTION: A communication module has: a component built-in type multilayer wiring board having first and second surfaces; surface-mount array-shape arrangement terminals provided on the second surface of the multilayer wiring board; and a semiconductor component mounted on the multilayer wiring board and having a communication processing circuit. The array-shape arrangement terminals have a first terminal group aligned in longitudinal and latitudinal directions at a constant arrangement pitch, and a second terminal group provided in a second region adjacent to a first region on the second surface of the multilayer wiring board where the first terminal group is located, and aligned in a longitude line direction or a latitude line direction at an arrangement pitch different from the above arrangement pitch. The second terminal group includes at least one terminal group of a third terminal group for signal input/output, a fourth terminal group for testing, a fifth terminal group for supplying a reference voltage, and a sixth terminal group for inputting a state setting signal. |
