| 发明名称 |
ELECTRICALLY CONDUCTIVE STRUCTURAL ADHESIVE |
| 摘要 |
The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures. |
| 申请公布号 |
EP2739690(B1) |
申请公布日期 |
2016.08.10 |
| 申请号 |
EP20120819629 |
申请日期 |
2012.06.15 |
| 申请人 |
HENKEL IP & HOLDING GMBH |
发明人 |
LEVONDOSKI, SUSAN, L.;BAIL, SAMUEL, C.;WALSH, TIMOTHY, P. |
| 分类号 |
C09J9/02;C09J4/02;C09J11/00;C09J133/08 |
主分类号 |
C09J9/02 |
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