发明名称 半導体ウェーハの評価方法
摘要 A method for evaluating a semiconductor wafer including preparing a reference wafer in which contamination element and amount of contamination are known, forming a plurality of cells including p-n junctions on the reference wafer, measuring junction leakage currents in the plurality of cells on the reference wafer to acquire a distribution of the junction leakage currents of the reference wafer, associating the distribution of the junction leakage currents of the reference wafer with a contamination element, forming a plurality of cells including p-n junctions on a wafer to be measured, measuring junction leakage currents in the plurality of cells on the wafer to be measured to acquire a distribution of the junction leakage currents of the wafer to be measured, and identifying a contamination element of the wafer to be measured based on the association.
申请公布号 JP5967019(B2) 申请公布日期 2016.08.10
申请号 JP20130115550 申请日期 2013.05.31
申请人 信越半導体株式会社 发明人 大槻 剛
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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