| 主权项 |
1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces, a plurality of substrate contacts at the first surface, and a plurality of terminals at the second surface configured for connecting the microelectronic package to at least one component external to the package; and first and second microelectronic elements having front surfaces facing the first surface of the substrate, each microelectronic element having a plurality of element contacts at the front surface thereof, the element contacts of each microelectronic element being joined with corresponding ones of the substrate contacts, the front surface of the second microelectronic element partially overlying a rear surface of the first microelectronic element and attached thereto, wherein the element contacts of the first microelectronic element are arranged in an area array and are flip-chip bonded with a first set of the substrate contacts, and the element contacts of the second microelectronic element are joined with a second set of the substrate contacts by conductive masses. |
