Optoelectronic Semiconductor Chip and Method for Producing Optoelectronic Semiconductor Chips

摘要

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer is disposed on the side of the active region facing the substrate. The first semiconductor layer is electrically conductively connected to a first termination layer that is disposed between the substrate and the semiconductor body. An encapsulation layer is disposed between the first termination layer and the substrate and, in plan view of the semiconductor chip, projects at least in some regions over a side face which delimits the semiconductor body.

主权项

1. A method for producing a plurality of optoelectronic semiconductor chips, the method comprising:
providing a semiconductor layer sequence on a substrate, wherein the semiconductor layer sequence has an active region arranged between a first semiconductor layer of a first conduction type and a second semiconductor layer of a second conduction type, wherein the second conduction type differs from the first conduction type; forming a first connection layer on the semiconductor layer sequence; forming an encapsulation layer on the first connection layer; forming a composite assembly comprising the semiconductor layer sequence and a carrier; forming a plurality of semiconductor bodies from the semiconductor layer sequence, wherein the encapsulation layer is exposed in regions; and singulating the composite assembly into a plurality of semiconductor chips.