Method for Improving Manufacturability of Cavity Packages for Direct Top Port MEMS Microphone

摘要

A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.

主权项

1. A package to house a microelectromechanical system (MEMS) device comprising:
a package base having a first interior portion and a first perimeter portion; a lid having a second interior portion and a second perimeter portion, wherein the first interior portion and the second interior portion are substantially planar; a cavity defined by the package base and the lid; a non-planar portion in at least one of the first interior portion and the second interior portion; a port extending through the non-planar portion to the cavity; and an attachment portion within the cavity and proximate the port, wherein the attachment portion is configured to receive a MEMS device.