| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that the cooling efficiency of the whole electronic device is decreased when a cooling device using a phase change is mounted to the thin electronic device.SOLUTION: The cooling device 20 includes: a refrigerant 90; a boiling unit 50 for phase-changing the refrigerant 90 from a liquid state to a gaseous state and absorbing heat; a condensing unit 60 for releasing the heat by phase-changing the refrigerant 90 from the gaseous state to the liquid state; a steam tube 70 and a liquid tube 80 that connect the boiling unit 50 and the condensing unit 60 where a housing of the boiling unit which configures the boiling unit 50 constitutes a flow path for circulating cooling air to cool the condensing unit 60. |
