发明名称 操作装置
摘要 The manipulation device includes: a fixing portion having a fixing surface to be fixed on an object; a moving part that has a moving surface arranged to face the fixing surface and is configured such that the relative position of the moving surface with respect to the fixing surface is manually adjusted; a fixing portion side circuit component that is arranged at the fixing portion; a moving portion side circuit component that is arranged at the moving portion so as not to be in contact with the fixing portion side circuit component, and includes an electric circuit where the impedance as measured from the fixing portion side is a predetermined impedance; and an input portion that is arranged at the moving portion manually operable, and changes the impedance of the electric circuit measured from the fixing portion.
申请公布号 JP5962597(B2) 申请公布日期 2016.08.03
申请号 JP20130129596 申请日期 2013.06.20
申请人 株式会社デンソー 发明人 立入 泉樹
分类号 H01H19/00;G06F3/033 主分类号 H01H19/00
代理机构 代理人
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