SUBSTRATE PROCESSING APPARATUS

摘要

The present invention provides a substrate processing unit, which comprises: a process chamber; a susceptor arranged in the process chamber to be able to rotate, wherein a wafer is put on an upper part; and a rotary shaft connected to a lower part of the susceptor to transfer rotary force, and is characterized in that the rotation center of the susceptor is different from that of the wafer. In addition, the present invention provides the substrate processing unit, comprising: the process chamber; the susceptor arranged in the process chamber to be able to rotate, wherein a wafer is put on an upper part; the rotary shaft connected to the lower part of the susceptor to transfer rotary force; a heating unit disposed on the lower part of the susceptor to heat the susceptor; and a reflective plate intervened between the susceptor and the heating unit to evenly transfer heat radiated from the heating unit to a lower surface of the susceptor.