| 摘要 |
The lighting device includes a substrate, a light-emitting element formed over one of surfaces of the substrate, and a rear surface metal layer formed on another surface of the substrate, which is opposite to the surface over which the light-emitting element is formed. The light-emitting element has a structure in which an organic compound layer containing a light-emitting substance is provided between a pair of electrodes. The substrate has a layered structure of an organic insulating layer and a metal layer including at least one internal metal layer. The internal metal layer is thermally bonded to the rear surface metal layer through a via hole formed in the organic insulating layer. The resistance of the via hole is lower than that in the case of thermal bonding not through the via hole. |
