METHODS AND APPARATUSES TO PROVIDE AN ELECTRO-OPTICAL ALIGNMENT

摘要

Exemplary embodiments of methods and apparatuses to provide an electro-optical alignment are described. An electrical connector is formed on a printed circuit board substrate that extends onto a side surface of the substrate to form an electrical turn. An optoelectronic die is placed onto the printed circuit board substrate. The optoelectronic die on the printed circuit board substrate is erected over a mounting board to provide optical coupling substantially parallel to the mounting board.