发明名称 |
LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METHOD FOR BONDING DISSIMILAR ELECTRODES TO ELECTRONIC COMPONENTS |
摘要 |
When soldering a package having an electrode on which Ni/Au or Ag-Pd alloy is plated to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within the inside of a layered solder material for bonding different species of electrodes by heating and cooling the layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn-Ag-Cu series or Sn-Sb series and a solder material of Sn-Ag-Cu-Ni series or Sn-Pb series. The electrode on which Ni/Au or Ag-Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn-Ag-Cu series or Sn-Sb series being attached to the Cu electrode and the solder material of Sn-Ag-Cu-Ni series or Sn-Cu series being attached to the electrode on which Ni/Au or Ag-Pd alloy is plated. This allows formation of intermetallic compounds to be restrained, thereby soldering them with high bonding reliability. |
申请公布号 |
EP2926940(A4) |
申请公布日期 |
2016.08.03 |
申请号 |
EP20130859516 |
申请日期 |
2013.11.18 |
申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
WATANABE KOJI;TOYODA MINORU;TOMITA SATOSHI;SUGINO TSUTOMU;KIKUCHI DAICHI;OSHIMA HIROKI |
分类号 |
B23K35/14;B23K1/00;B23K1/19;B23K35/02;B23K35/26;B23K35/40;B23K101/42;B23K103/18;B32B15/01;C22C1/00;C22C11/06;C22C13/00;C22C13/02;C22C21/14;H05K3/34 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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