发明名称 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF
摘要 The present invention provides a curable composition, which contains a crosslinking aid (B) containing three or more allyl groups in the molecule in an amount of 1 to 50 parts by mass, polyfunctional (meth)acrylic compound (C) in an amount of 5 to 50 parts by mass, and photopolymerization initiator (D1) and/or thermal polymerization initiator (D2) in an amount of 0.1 to 10 parts by mass, respectively, as a polymerization initiator (D) to 100 parts by mass of allyl group-terminated allyl ester oligomer (A); wherein the crosslinking aid (B) containing allyl group is a compound containing three or more allyl groups in a molecule; wherein the content of impurities derived from the crosslinking aid (B) in the curable composition is less than 0.1 mass%; wherein the content of the (meth)acrylic compound containing a hydroxyl group in a molecule (C1) in the curable composition is 0.5 to 30 mass%. By polymerizing and curing the curable composition of the present invention, it is possible to obtain a film or sheet material having a transparency required for optical applications, high surface hardness, excellent heat resistance and low linear expansion coefficient.
申请公布号 EP2963070(A4) 申请公布日期 2016.08.03
申请号 EP20140756672 申请日期 2014.02.27
申请人 SHOWA DENKO K.K. 发明人 INOUE HIROFUMI;MUKOBAYASHI MIYO
分类号 C08F218/16;C08F263/08 主分类号 C08F218/16
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