SOLDER MATERIAL COMPRISING A REACTIVE FILLER MATERIAL, CARRIER ELEMENT OR COMPONENT COMPRISING SAID TYPE OF SOLDER MATERIAL AND USE OF A FLUXING AGENT

摘要

The invention relates to a solder material, a carrier element or component with contact surfaces for solder connections, and a fluxing agent for soldering. According to the invention, in addition to the solder material, a filler material with reactive components is used to from the solder connections. Said reactive components are advantageous with respect to heat influx in the solder connections based on an exothermic reaction. As a result, the solder connections that are to be formed are heated more quickly than the remaining components that are to be soldered making it possible to work with a low external heat influx. In particular, lead-free solder alloys can be processed at the conventional process temperatures TO. In particular, the temperature in the solder oven TO can be outside of the melting temperature TS of the solder deposit. Preferably, the reactive component is a metal-carbonyl-compound which can react exothermically with oxygen.