BONDING APPARATUS AND BONDING METHOD

摘要

The present invention is to detect a slope of a collet by a simple configuration. According to the present invention, the bonding device has a die moving unit with a collet capable of adsorbing a die, a protrusion installed in a location capable of contacting the collet, and a determining unit configured to determine a slope of the collet based on each height when a plurality of locations of the collet contact the protrusion. Therefore, the bonding device can improve a throughput even when laminated bonding is performed by a plurality of mounting devices.