| 摘要 |
PROBLEM TO BE SOLVED: To precisely grind a plate-like workpiece to a predetermined thickness even when the plate-like workpiece is formed of a hardly grindable material.SOLUTION: A grinding device 1 comprises: a first grinding means 20 applying creep feed grinding to a plate-like workpiece W; a second grinding means 30 applying infeed grinding to the plate-like workpiece W subjected to rough grinding; and a thickness measurement part 6 measuring a thickness of the plate-like workpiece during the infeed grinding. Accordingly, a grinding removal amount of the plate-like workpiece can be increased during the grinding by the first grinding means 20, and the plate-like workpiece W can be subjected to finish grinding while monitoring the thickness of the plate-like workpiece W by the thickness measurement part 6 during the grinding by the second grinding means 30. Accordingly, even when the plate-like workpiece W is formed of a hardly grindable material, the plate-like workpiece W can be more precisely and efficiently ground to a predetermined thickness than conventional ones. |
