| 摘要 |
Provided are a light-emitting diode (LED) package and a manufacturing method therefor. The LED package comprises: a first support frame (10), several LED components (20), a packaging adhesive (30), and a quantum strip (40). The first support frame (10) comprises a PCB (12) and four sidewalls (14). The four sidewalls (14) enclose an accommodating space (18). The several LED components (20) are mounted onto the PCB (12) and are electrically connected thereto. The packaging adhesive (30) is filled into the accommodating space (18). Mounting parts (16) are provided at upper ends of the four sidewalls (14). The quantum strip (40) is mounted onto the mounting parts (16). The quantum strip (40) is located above the packaging adhesive (30). The first support frame (10), the several LED components (20), and the quantum strip (40) are integrally packaged to be fixedly assembled together. |
