摘要 |
PROBLEM TO BE SOLVED: To allow an electronic component mounting device with two mounting heads equipped with a plurality of adsorption nozzles to efficiently perform imaging and recognition processing of an electronic component at one time of imaging.SOLUTION: When mounting heads 6A1 and 6A2 are positioned above lighting devices 23A and 23B, light is emitted toward an electronic component D held in each adsorption nozzle 5. By mirrors 21A and 21B, half the light reflected by the electronic component D is transmitted and half-reflected to come in a prism 16 from the lateral direction. Then, half the reflected light from left side from the half mirror 21A is transmitted and half-reflected downward by half mirrors 16A and 16B, and half the reflected light from right side form the half mirror 21B is transmitted and half-reflected downward by half mirrors 16A and 16D so that a reflection image synthesized as one image is taken by a component recognition camera 15. |