发明名称 ダイレクトダイオードレーザ加工装置及びこれを用いた板金の加工方法
摘要 A direct diode laser machining device is provided with: a laser oscillator that emits multi-wavelength laser light; a transmission fiber that transmits the multi-wavelength laser light emitted by the laser oscillator; and a laser machining device that condenses the multi-wavelength laser light transmitted by the transmission fiber and machines a workpiece. The light intensity distribution in the thickness direction of the workpiece has a plurality of peaks that are based on chromatic aberration in the multi-wavelength laser light and the wavelength dependence of the emissivity of the workpiece.
申请公布号 JP5965454(B2) 申请公布日期 2016.08.03
申请号 JP20140209908 申请日期 2014.10.14
申请人 株式会社アマダホールディングス 发明人 臼田 かおり
分类号 B23K26/38;B23K26/00;B23K26/064;B23K26/40 主分类号 B23K26/38
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