SENSING CHIP AND METHOD FOR MAKING THE SENSING CHIP

摘要

The present invention relates to a sensing device and to a method for manufacturing the same including: a substrate; a bonding layer to be formed on the substrate; a sensing layer to be connected to the substrate through the bonding layer; and a wire to be connected to the substrate through the bonding layer and to be in contact with the sensing layer. The thickness of the sensing layer is thinner than the wire. Therefore the sensing device can be minimized.