| 摘要 |
A substrate processing apparatus, in which a substrate is conveyed in a first direction and a surface to be processed of the substrate is processed, is provided with: a first guide member that guides the substrate in the first direction; a second guide member that guides the substrate guided thereto by the first guide member; a tension imparting mechanism that applies a tension to the substrate between the first guide member and the second guide member and reduces the dimension of the substrate in a second direction that intersects with the first direction; and a processing device that processes a surface to be processed of the substrate between the first guide member and the second guide member. |
